ʻO ka ʻenekini kaomi ʻenekona 2CP3-68 1946725 no Carter excavator

ʻO kahi ala no ka hoʻomākaukau ʻana i kahi sensor kaomi, i hōʻike ʻia me ka loaʻa ʻana o nā pae aʻe:

S1, hāʻawi i kahi wafer me ka ʻili hope a me ka ʻili mua;Ka hana ʻana i kahi ʻāpana piezoresistive a me kahi wahi hoʻopili i hoʻopaʻa ʻia ma ka ʻili mua o ka wafer;Ka hana ʻana i ka lua hohonu ma ke kālai ʻana i ka ʻili hope o ka wafer;

S2, hoʻopaʻa i kahi pepa kākoʻo ma ke kua o ka wafer;

S3, e hana ana i na puka kepau a me na uwea metala ma ka aoao mua o ka wafer, a me ka hookui ana i na kaula piezoresistive e hana i alahaka Wheatstone;

S4, waiho a hoʻokumu i kahi papa passivation ma ka ʻaoʻao mua o ka wafer, a wehe i kahi ʻāpana o ka papa passivation e hana i kahi ʻāpana metala.2. ʻO ke ʻano hana o ka mea ʻike kaomi e like me ke koi 1, kahi i loaʻa ai iā S1 nā ʻanuʻu penei: S11: hāʻawi i kahi wafer me kahi ʻili hope a me kahi ʻili mua, a me ka wehewehe ʻana i ka mānoanoa o kahi kiʻi ʻoniʻoni koʻikoʻi ma ka wafer;S12: hoʻohana ʻia ka hoʻokomo ʻana i ka ion ma ka ʻaoʻao mua o ka wafer, hana ʻia nā ʻāpana piezoresistive e kahi kaʻina diffusion wela kiʻekiʻe, a ua hoʻopili nui ʻia nā wahi pili;S13: waiho a hoʻokumu i kahi papa pale ma ka ʻili mua o ka wafer;S14: hoʻopaʻa ʻia a hoʻokumu i kahi lua hohonu kaomi ma ke kua o ka wafer e hana i kahi kiʻiʻoniʻoni koʻikoʻi.3. ʻO ke ʻano hana o ka mīkini kaomi e like me ke koi 1, kahi o ka wafer SOI.

I ka makahiki 1962, ʻo Tufte et al.ua hana ʻo ia i kahi mea ʻike piezoresistive pressure me nā ʻāpana piezoresistive silicon diffused a me ke ʻano kiʻi kiʻiʻoniʻoni no ka manawa mua, a hoʻomaka i ka noiʻi ʻana i ka sensor piezoresistive pressure sensor.I ka hopena o nā makahiki 1960 a me nā makahiki 1970, ʻo ke ʻano o nā ʻenehana ʻekolu, ʻo ia hoʻi, silicon anisotropic etching technology, ion implantation technology and anodic bonding technology, ua lawe mai i nā loli nui i ka sensor kaomi, kahi i hana nui i ka hoʻomaikaʻi ʻana i ka hana o ka mīkini paʻi. .Mai ka makahiki 1980, me ka hoʻomohala hou ʻana o ka ʻenehana micromachining, e like me ka anisotropic etching, lithography, diffusion doping, implantation ion, hoʻopaʻa a me ka uhi ʻana, ua hoʻemi mau ʻia ka nui o ka sensor kaomi, ua hoʻomaikaʻi ʻia ka naʻau, a ua kiʻekiʻe ka hopena. maikaʻi ka hana.I ka manawa like, ʻo ka hoʻomohala ʻana a me ka hoʻohana ʻana i ka ʻenehana micromachining hou e hoʻomalu pono i ka mānoanoa kiʻiʻoniʻoni.